XPCB Limited
Tel: +86-755-2301 2705
E-mail: info@apexpcb.com
Add:Building 3, JinFeng Industry Area, Heping Community, Fuyong Town, Baoan District, Shenzhen, 518103, China
Rigid Flex PCB design alternative for layer stack-up
Polar Instruments adds Speedflex rigid flex PCB ability to its Speedstack layer stackup design system.
Polar Instruments claimed it included a rigid flex PCB (printed circuit board) design choice to its Speedstack PCB layer stackup design system, which the company stated enables OEM developers and PCB manufacturers to produce and precisely file PCB stackups, combining rigid and rigid flex PCB, and to lower manufacturing costs via fast assessment of a vast array of alternate materials and distributors.
The company claimed the Speedflex option supplies developers with an ultra fast procedure that could build rigid flex PCB stacks in mins, document drills, show the heaps as a 2 or three-dimensional image, and add regulated resistance, with goal-seeking, to finish the design. Speedstack does not limit the variety of layers that can be included, or the variety of cross-sections that can be developed and contrasted, including coverlays, adhesives, and no-flow prepreg layers, enabling even more adaptability to tweak the stack design for optimal expense and efficiency.
The finished stack is recorded immediately and can be exported in industry common documents layouts, which helps get rid of manual mistakes and makes sure that the PCB specs are interacted plainly and consistently to every firm and individual in the design and PCB fabrication process.
While error-free information tightens up control over the finished board, Speedflex also provides the versatility for PCB manufacturers to safely reduce pcb manufacturing expenses. Collections of materials, vendors, prices and lead-times show the effect that transforming materials or providers will certainly have on the price, lead-time and electric specs of the completed board, which helps in reducing the time taken to manually determine the influence of each small adjustment to the board and provides extra possibilities to locate one of the most affordable materials and distributors within the electric requirements of the completed board.
XPCB Limited
Tel: +86-755-2301 2705
E-mail: info@apexpcb.com
Add: Building 3, JinFeng Industry Area, Heping Community, Fuyong Town, Baoan District, Shenzhen, 518103, China