Rigid PCB With Impedance

Product Introduction

X-PCB is a leading quick-turn prototype and high volume PCB manufacturer in Shenzhen. Our product covers from common FR-4 boards, High Tg FR-4 boards to microvia solutions, plugged via-holes, peelable mask, metal backed boards, and flex-rigid boards.

This board uses black solder mask and white silkscreen. The layer is 6 with 1.6mm finished board thickness. The min hole size is 0.25mm, and the min mechanical hole size we can make is 0.15mm.

Product Parameter

Product Feature And Application

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package’s leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

The outer copper thickness and inner copper thickness are both 1OZ. The min line sapce/width is 0.1mm. This board uses two surface treatment: ENIG and OSP. ENIG is for most area, and OSP is selective. It is used on Unmanned aerial vehicle(UAV). The BGA tolerance is very strict.

FAQ

● Q: Are you a factory or trade company?

A: X-PCB is a PCB/FPC manufacturer/factory. We are good at fabricating multilayer FPC and rigid-flex pcb.

● Q: Can I get a sample?

A: Yes, It’s reasonable to get a sample to test our quality at first.

● Q: What is the lead time?

A: The lead time is 2 to 10 days.

● Q: Will the boards be tested before shippment?

A: Yes,all PCBs will be tested by Flying Probe or E-test fixture.