We have all kinds of base material, such as: High Tg, High CTI, High copper, Rogers, Arlon, HDI, Aluminium.
The board is a 4L FPC. The finished board thickness is 0.47mm with 1oz copper. The surface treatment is Immersion Au.
TH Via (Size/Pad)
Min. Line Space
Product Feature And Application
HDI (high density interconnection) circuit boards and Microvia Technology are inextricably linked. Microvias are minute holes drilled by a laser to generate the electrical connection between the layers in a multilayer circuit board.
This board is used in consumer electronics. Its lamination is special. The FR4 and PI stifferner are used on this board. It uses amber cover film and white silkscreen.
● Strong process capability:
Max Layer Count: 36L Max Final Board Thickness: 7.0mm
Max PTH Aspect Ratio: 10:1 Max Finished Copper Thickness: 20 OZ
Max Panel Size: 622*610mm Min Line Width/ Space: 0.075/ 0.075mm