Rigid Flexible Printed Circuit Board

Product Introduction

X-pcb is a leading factory of prototypes and volume pcb in Shenzhen. We can offers a wide range of different printed circuit boards to our customers in the world.

Some Capabilities:

Soldermask bridge between solder dam: 4 mil (0.10 mm)

Minimun soldermask annular: 1.5 mil (0.038 mm)

Plugged hole size: 0.15 mm – 0.5 mm

Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating.

Special techniques: Blind and buried vias (min hole size is 0.1 mm), high layer with heavy copper.

The mentioned pcb is 8 layer rigid flex pcb board. The board thickness is 1.0mm with 1oz copper. Black solder mask and yellow coverlay are used on this board. The finishing is Electroless Nickel/ Immersion Gold.

Product Parameter

Product Feature And Application

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.

The BGA in this boad is 0.2mm which is harder to fabricate. Its Min. trace width/ space is 3mil, and it has contorlled impeance, so the requirement of trace width and space is strict.

Why buy PCB from X-PCB?

● Advanced and full range of manufacturing facilities, we own the key high-end equipment for multilayer PCB, such as Laminator, Double-drawer Pinless Machine, X-Ray Drilling machine, CCD Automatic exposure machine, etc.

● Offer expedited service for prototyping, small batch production.

● PCB factory passed UL, ISO90001: 2008 and ISO/TS16949: 2009 certification, which is the strong confidence for quality.

● Free DFM: If customers need DFM before payment,we can provide free DFM.