XPCB Limited
Tel: +86-755-2301 2705
E-mail: info@apexpcb.com
Add:Building 3, JinFeng Industry Area, Heping Community, Fuyong Town, Baoan District, Shenzhen, 518103, China
Circuit boards and components in the welding process to produce warping, due to stress deformation and resulting in false welding, short circuit and other defects. Warping is often caused by an unbalanced temperature in the upper and lower parts of the circuit board. For large PCBS, warping can also occur due to the weight of the board itself. The common PBGA device is about 0.5mm from the printed circuit board, if the device on the circuit board is large, with the circuit board cooling back to normal shape, the solder will be under stress for a long time, if the device elevation 0.1mm is enough to cause virtual welding open.
XPCB Limited
Tel: +86-755-2301 2705
E-mail: info@apexpcb.com
Add: Building 3, JinFeng Industry Area, Heping Community, Fuyong Town, Baoan District, Shenzhen, 518103, China
